Alice Bean

                    US Testing

FE electronics -
       hybrids functionally tested after reception
       if they fail - ship back to Europe to fix except small
wirebonding jobs

Sensors -
       visually inspected
       fraction are probed at KSU

Modules
       optical inspection after fluing
       fast acceptance test after bonding, pull bonds if needed
       do  dead channel testing without using laser scan but with
       bias tests
       assure that bonding is proceeding smoothly by calibrating
       machines with pull tests daily - we don't think temperature
       cycling will be needed

For all cases, if we can get away without temperature cycling we should

At the start if you find "bad" modules set them aside and hope you don't
       have to repair although our Fermilab experiences say that 80% of
       our time was spent on repairs and non-optimal modules

We need to have a strict go - nogo rule so that variations by grade will
      not have to be decided upon for rod assembly

We would like to do the minimal tests necessary for completion as we are
     worried that repairs might dominate in the end