TIB Module Construction Procedures:

Tests at Bonding^(*) and Long Term Centres

For fully qualified ^(**) centres

(If you are in the starting phase of final production, please refer to Initial Procedures)

 Version 3, 24 Mar 2004

^(*)Please follow official Bonding Procedures, wherever needed, in here

(**) at least 30 modules built and tested with no problems

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1) Module transport box receiving:

   1a) Unpack it

   1b) Store it into the clean room

   1c) Register the transfer on DataBase  “WorkStations èTransfer” panel of the BigBrowser

   1d) Create the directory structure for test local data storing

 

2) Visual inspection:

   2a) Visual inspection under a microscope

       2aa) Look at the silicon borders

       2ab) Look at the APV bonds (control and PS + APV-pitch adapter)

       2ac) Look at the silicon surface

   2b) Dismount the module from its transport carrier (unscrewing the

       transport plexiglass protection plate - take care about the blue

       spacers)

   2c) Mount the module on the test support plate and protect it using

       the thick test plexiglass plate

 

3) Rapid test (using the following hybrid configuration file: .xml)

   3a) ARC test of the hybrid

       3aa) Fast test h+pa settings (all tests, no ROOT file output)

       3ab) Deep test

           i) Ped, noise, CMN (only Peak InvOn)

           ii) PulseShape (only Peak InvOn)

           iii) Pipeline (Peak InvOn)

           iv) Look at the ARC log file

   3b) Move the files on the 1_arrival directory (or on any local data storage place)

 

4) HV lines and Strips Bonding

à follow the bonding working group procedures listed here

 

5) IV and ARC test (using the following module configuration file: .xml)

   5a) Extract IV from DB (Bari LabView program can be used) and copy it into the ARC output

   directory

   5b) ARC test of the module

       5ba) Set HV bias at 400V (max ramp up speed of 10V/s)

       5bb) Fast test module settings (all tests, no ROOT file output)

       5bc) Deep test: in All Tests panel select:

           i) IV test

           ii) Ped, noise, CMN (all four modes)

           iii) PulseShape (all four modes)

           iv) Pipeline (Peak InvOn)

           v) Pinhole

           vi) LED

   5c) Look at the ARC log file

   5d) Use the Temperature compensation to check IV data compatibility

            with DB sensor test information

   5e) Write the .xml file on the DB (Peak InvOn for pedestal data)

   5f) Move the files on the 3_bonding directory (or on any local data storage place)

   5g) Run the Tony's macros and move the plots on the postscript directory

   5h) Run root2ps and move the plots to the postscript directory

       

6) Long Term

  6a) Insert six modules into the Vienna box

  6b) Perform a standard scenario (scenario, ß rapidly evolving, please check it frequently! .xml, .dtd)

  6c) Write the .xml produced file on the DB

  6d) Run the appropriate macros on the root files and store the plots on the

       web directory (or on any local data storage place)

  6e) Extract the modules from the Vienna box

  6f) Dismount the modules from the support plates

  6g) Mount the modules on their transport plates

  6h) Store the modules in a clean and electrostatic safe cupboard.

Last updated: 24/3/2004 by Carlo Civinini, MM, Urzahil, rr